A. Fourmigue, G. Beltrame, and G. Nicolescu. Efficient transient thermal simulation of 3d ics with liquid-cooling and through silicon vias. In Proc. of the Design Automation and Test in Europe Conference (DATE), 1385–1390. March 2014.
[BibTeX▼]


Contents © 2019 MIST Lab - Powered by Nikola
  • Follow us: